Title:
導電膜形成用組成物、前駆体膜、前駆体膜の製造方法、および導電膜の製造方法
Document Type and Number:
Japanese Patent JP7094205
Kind Code:
B2
Abstract:
To provide a conductive film-forming composition that can form a conductive film having excellent conductivity at a temperature of 150°C or lower, a precursor film, a method for producing a precursor film, and a method for producing a conductive film.SOLUTION: A conductive film-forming composition contains a metal copper-copper nitride composite particle with the surface of metal copper covered with copper nitride, and at least one binder selected from the group consisting of a halogen compound and a phosphorus-containing compound.SELECTED DRAWING: None
Inventors:
Tanabe Jun
Application Number:
JP2018210444A
Publication Date:
July 01, 2022
Filing Date:
November 08, 2018
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
H01B1/22; B22F1/00; H01B1/00; H01B5/14; H01B13/00
Domestic Patent References:
| JP2010121206A |
Attorney, Agent or Firm:
Hideaki Ito
Fumio Mihashi
Fumio Mihashi
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