Title:
COOLING COMPONENT AND MOUNTING SUBSTRATE USING THE SAME
Document Type and Number:
Japanese Patent JP2018035947
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a cooling component which deals with a mounting component with higher density, has high cooling ability, and achieves excellent flexibility of the posture.SOLUTION: A cooling component according to the invention has: a partition wall including a heat receiving part which receives heat from a heating body, and a heat radiation part which emits heat to the outside; a working fluid disposed in the partition wall; and a mesh structure part provided between the partition wall and the working fluid. Materials of the partition wall and the mesh structure are the same.SELECTED DRAWING: Figure 1
Inventors:
KUWABARA KOSUKE
Application Number:
JP2016166403A
Publication Date:
March 08, 2018
Filing Date:
August 29, 2016
Export Citation:
Assignee:
HITACHI LTD
International Classes:
F28D15/04; F28D15/02; H05K7/20
Attorney, Agent or Firm:
Yuji Toda
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