Title:
グランド又は電源回路より伝送線をシールドするための装置
Document Type and Number:
Japanese Patent JP4454926
Kind Code:
B2
Abstract:
The device comprises an integrated circuit (IC) and a set of connection pads for connecting the integrated circuit to at least one pair of transmission lines designed to conduct electric signals to a destination, the first pair of connection pads designed for receiving the first supply voltage, the second pair of connection pads designed for receiving the second supply voltage, and the third pair of connection pads designed for connection to the transmission lines. The signal connection pads are surrounded by the first and second pairs of the supply connection pads so to implement a specific shielding of the transmission lines. Each pair of the supply connection pads can be connected to the ground (GND) or to the high or low supply voltage thus implementing two possible supply configurations, positive or negative, so that the ground can correspond to either high or low supply voltage. The pair of transmission lines (S1,S2) comprises two components (S1I,S1IQ;S2I,S2IQ) for transmitting simultaneously and in parallel the differential electric signals, where each component is connected to a distinct signal connection pad. The pair of transmission lines is associated with a pair of return lines designed to conduct electric signals in opposite direction, so that the pair of connection pads designed to receive the ground is connected to the return lines. The pairs of connection pads are laid out symmetrically with respect to a plane perpendicular to the plane of the integrated circuit and parallel to the transmission lines through a middle point separating the lines. The integrated circuit is inside a casing (1), and the signal connection pads are bordering on the casing so to make them immediately accessible to the transmission lines. The casing is of type Ball Gate Array (BGA). A printed circuit comprises a support of insulating material for supporting the device, where the transmission lines and the return lines are printed on the circuit board. A telecommunication apparatus comprises the device.
Inventors:
Philip, Bar
Gilbert, Groagung
Gilbert, Groagung
Application Number:
JP2002323857A
Publication Date:
April 21, 2010
Filing Date:
November 07, 2002
Export Citation:
Assignee:
NXP B.V.
International Classes:
H04B15/00; H05K9/00; H01L23/48; H01L23/498; H01L23/50; H01L23/528; H01L23/552; H01L23/58; H05K1/02; H05K3/34
Domestic Patent References:
| JP2000349192A | ||||
| JP63090865U | ||||
| JP2001094032A | ||||
| JP9102433A | ||||
| JP11317471A |
Attorney, Agent or Firm:
Kenji Yoshitake
Hidetoshi Tachibana
Takeshi Sekine
Takahashi
Hidetoshi Tachibana
Takeshi Sekine
Takahashi