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Patent Searching and Data


Title:
電子部品
Document Type and Number:
Japanese Patent JP7351094
Kind Code:
B2
Abstract:
An electronic component includes an element body and an external electrode. The element body includes a side surface and an end surface. The external electrode includes a conductive resin layer disposed over the side surface and the end surface. The conductive resin layer includes a first region positioned on the end surface, a second region positioned on the side surface, and a third region positioned on a ridge portion between the end surface and the side surface. In a case where a maximum thickness of the first region is T1 (μm), a maximum thickness of the second region is T2 (μm), and a minimum thickness of the third region is T3 (μm), the maximum thickness T1 and the maximum thickness T2 satisfy a relation ofT2/T1≥0.11,and the maximum thickness T1 and the minimum thickness T3 satisfy a relation ofT3/T1≥0.11.

Inventors:
Yuichi Nagai
Atsushi Takeda
Taketoshi Tamura
Shinya Onodera
Application Number:
JP2019056112A
Publication Date:
September 27, 2023
Filing Date:
March 25, 2019
Export Citation:
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Assignee:
TDK Corporation
International Classes:
H01C7/04; H01G4/30; H01C7/10; H01F27/29
Domestic Patent References:
JP2017191929A
JP2017120819A
JP2013191832A
JP2017073434A
JP2017216288A
JP2018046229A
Foreign References:
US20170301468
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Takashi Mikami