Title:
電子制御装置
Document Type and Number:
Japanese Patent JP7257893
Kind Code:
B2
Abstract:
A temperature rise due to thermal interference between electronic components is suppressed. Electronic components (11a, 11b) are adjacently mounted on a circuit board (12). The circuit board (12) is fixed to a base (13). A rectangular convex portion (21) is provided on the base (13). The rectangular convex portion (21) is disposed so as to be located below the electronic components (11a, 11b) when the circuit board (12) is assembled to a housing (10). The rectangular convex portion (21) includes N concave portions (21a). The concave portions (21a) are arranged on a surface (21b) facing the region between the electronic components (11a, 11b).
Inventors:
Yasuhiro Rouki
Toshiaki Ishii
Yoshio Kawai
Toshiaki Ishii
Yoshio Kawai
Application Number:
JP2019117066A
Publication Date:
April 14, 2023
Filing Date:
June 25, 2019
Export Citation:
Assignee:
Hitachi Astemo, Ltd.
International Classes:
H01L23/36; H01L23/12; H01L25/04; H01L25/18; H05K1/18; H05K7/20
Domestic Patent References:
| JP2011192937A | ||||
| JP2017011021A | ||||
| JP2011023593A | ||||
| JP2015060865A |
Attorney, Agent or Firm:
Patent Attorney Corporation Wilfort International Patent Office
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