Title:
EPOXY RESIN COMPOSITION FOR SEALING, CURED PRODUCT, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018002911
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing which is excellent in fluidity, curability and storage stability and suppresses emission of benzene caused by a curing accelerator, while containing a phenolic resin having a novolak structure containing a biphenyl derivative in the molecule and an epoxy resin having a novolak structure containing a biphenyl derivative in the molecule.SOLUTION: An epoxy resin composition for sealing contains an epoxy resin having a specific structure, a phenolic compound as a curing agent, and specific phosphonium salt as a curing accelerator.SELECTED DRAWING: None
Inventors:
OGAWA KAZUTO
IWATANI EMI
TAKAGI KEIGO
NISHIDONO KYOKO
MATSUMOTO NAOKI
TSUJI TAKAYUKI
IWATANI EMI
TAKAGI KEIGO
NISHIDONO KYOKO
MATSUMOTO NAOKI
TSUJI TAKAYUKI
Application Number:
JP2016132788A
Publication Date:
January 11, 2018
Filing Date:
July 04, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C08G59/68; C08K3/00; C08L63/04; H01L23/29; H01L23/31
Domestic Patent References:
| JP2017155068A | 2017-09-07 | |||
| JP2003261746A | 2003-09-19 | |||
| JP2007302771A | 2007-11-22 | |||
| JP2004292514A | 2004-10-21 | |||
| JP2005263843A | 2005-09-29 | |||
| JP2002179768A | 2002-06-26 | |||
| JP6197187B1 | 2017-09-20 | |||
| JP6023992B1 | 2016-11-09 |
Foreign References:
| US20140179827A1 | 2014-06-26 | |||
| WO2016120925A1 | 2016-08-04 |
Attorney, Agent or Firm:
Patent business corporation Hokuto patent office
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo
Keisei Nishikawa
Mizuhiji Katsuhisa
Yoshishige Takeo