Title:
An epoxy resin constituent and a semiconductor device
Document Type and Number:
Japanese Patent JP6189148
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide an epoxy resin composition which effectively prevents the generation of voids, can form an insulation section excellent in bondability with a circuit board and an electronic component, and can be used for manufacture of a semiconductor device having high reliability, and to provide a semiconductor device which effectively prevents generation of voids, has an insulation section excellent in bondability with a circuit board and an electronic component, and has high reliability.SOLUTION: An epoxy resin composition is used for manufacture of a semiconductor device, and contains: a liquid epoxy resin having two or more epoxy groups in the molecule; a curing agent; an inorganic filler; and a pre-gelating agent consisting of a vinyl polymer. The pre-gelation agent has a content of 2.0 wt.% or more and 20 wt.% or less, and gelates before the epoxy resin is cured when heated at 190°C.
Inventors:
Samejima Yuki
Application Number:
JP2013185305A
Publication Date:
August 30, 2017
Filing Date:
September 06, 2013
Export Citation:
Assignee:
Asekku Co., Ltd.
International Classes:
C08L63/00; C08G59/00; C08K3/00; C08L33/12; H01L21/60; H01L23/29; H01L23/31
Domestic Patent References:
| JP2013028813A | ||||
| JP2012077129A | ||||
| JP2002179886A | ||||
| JP2003049050A | ||||
| JP2001247746A |
Attorney, Agent or Firm:
Tatsuya Masuda
Kazuo Asahi
Kazuo Asahi