Title:
An etching solution for multilayer films, an etching concentrate, and an etching method
Document Type and Number:
Japanese Patent JP6128404
Kind Code:
B2
Abstract:
When an etchant that alone can etch a multilayer film comprising a copper layer and a molybdenum layer is used during mass production, it is important for the cross-sectional shape of an edge after etching to satisfy the shape requirement of having a forward taper without an undercut, and that no precipitate be formed in the etchant. A multilayer-film etchant containing a copper layer and a molybdenum layer contains hydrogen peroxide, an inorganic acid, an acidic organic acid, a neutral organic acid, an amine compound, and a hydrogen peroxide decomposition inhibitor, but not an azole compound; therefore, no reaction products are generated from a reaction with the hydrogen peroxide, and no precipitates form in the etchant. Furthermore, the cross-sectional shape of the edge after etching can be formed into a desirable forward tapering shape. Containing no phosphorus compounds or fluorine compounds, the etchant will case minimal damage to the environment when disposed.
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Inventors:
Wearability true
Yoshihide Osano
Shinichiro Fuchigami
Yoshihide Osano
Shinichiro Fuchigami
Application Number:
JP2015548894A
Publication Date:
May 17, 2017
Filing Date:
November 25, 2013
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C23F1/18; C23F1/26
Domestic Patent References:
| JP5051323B2 |
Attorney, Agent or Firm:
Masaki Hiroyuki