Title:
VAPOR DEPOSITION APPARATUS AND VAPOR DEPOSITION METHOD
Document Type and Number:
Japanese Patent JP2016204707
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a vapor deposition apparatus and a vapor deposition method that can measure a film thickness with high precision.SOLUTION: There is provided a vapor deposition apparatus comprising: a drain hole 10 arranged at a piping part 2 for guiding a material 8 vaporized at a vapor deposition source 3 in a vacuum chamber 1; a dummy substrate 12 arranged opposite the drain hole 10; a dummy substrate driving device 13 for rotating the dummy substrate 12; a film thickness measuring device 11 arranged at the back of the dummy substrate 12 opposite the drain hole 10 and optical measuring a thin film vapor-deposited on a top surface of the dummy substrate 12; and a dummy substrate heating device 14 heating the dummy substrate 12 and thus vaporizing and eliminating an unnecessary thin film after the film thickness of the vapor-deposited film is measured.SELECTED DRAWING: Figure 1
Inventors:
SUETSUGU DAISUKE
OKUMA TAKAFUMI
KOISHIZAKI TSUYOSHI
NAGAI HISAO
OKUMA TAKAFUMI
KOISHIZAKI TSUYOSHI
NAGAI HISAO
Application Number:
JP2015087798A
Publication Date:
December 08, 2016
Filing Date:
April 22, 2015
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
C23C14/24; H01L51/50; H05B33/10
Attorney, Agent or Firm:
Mitsuo Tanaka
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada
Samejima Mutsumi
Hiroshi Okabe
Mitsuo Wada
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