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Patent Searching and Data


Title:
LEAD BENDER FOR ELECTRONIC PARTS
Document Type and Number:
Japanese Patent JPH06568
Kind Code:
A
Abstract:

PURPOSE: To enable the rapid bending of the lead of electronic parts to a desired shape by rapidly and exactly judging whether the lead is inserted to the prescribed position on a substrate or not.

CONSTITUTION: This lead bender for the electronic parts consists of a pedestal 22 which is provided in the projecting direction of the lead L of the substrate S, a moving body 23 which is provided on the pedestal 22 and is freely movable forward and backward along one direction of the plane of the substrate S, a bending member 25 which is provided relatively displaceably with the moving body 23 and bends the lead L of the electronic parts and a detecting means 27 which detects the relative the moving body 23.


Inventors:
KAWAMURA YUTAKA
Application Number:
JP16135092A
Publication Date:
January 11, 1994
Filing Date:
June 19, 1992
Export Citation:
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Assignee:
TOKICO LTD
International Classes:
B21F1/00; (IPC1-7): B21F1/00
Attorney, Agent or Firm:
Masatake Shiga (2 outside)