Title:
EXPOSURE DEVICE, EXPOSURE METHOD AND DEVICE MANUFACTURING METHOD
Document Type and Number:
Japanese Patent JP2017062502
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To conduct high accuracy alignment of a substrate at high throughput and position a wafer to an exposure position with good accuracy.SOLUTION: A control device controls a driving system of a stage WST so that a wafer W is relatively moved in a Y direction against a plurality of detection regions for detecting a plurality of marks of the wafer W having different position in terms of the Y direction with at least a part of detection regions of alignment system (AL1, AL2to AL2) in a detection operation of marks of the alignment system (AL1, AL2to AL2), and controls the driving system using detection information on marks by the alignment system in an exposure operation of the wader W. Position information on the stage WST in terms of at least 3 freedom degree direction in an XY surface by a plurality of heads (64, 66) facing lattice parts (39Y, 39Y, 39X, 39X) of a measurement device in the detection operation of the marks and the exposure operation of the wafers respectively.SELECTED DRAWING: Figure 3
Inventors:
SHIBAZAKI YUICHI
Application Number:
JP2016238958A
Publication Date:
March 30, 2017
Filing Date:
December 09, 2016
Export Citation:
Assignee:
NIKON CORP
International Classes:
G03F9/00; G01B11/00; G03F7/20; H01L21/68
Domestic Patent References:
| JPH07270122A | 1995-10-20 | |||
| JP2006128693A | 2006-05-18 | |||
| JP2006210570A | 2006-08-10 | |||
| JPH11233420A | 1999-08-27 | |||
| JPH10163097A | 1998-06-19 |
Attorney, Agent or Firm:
Atsushi Tateishi