Title:
EXPOSURE DEVICE AND EXPOSURE METHOD, AND PRODUCTION METHOD FOR DEVICE
Document Type and Number:
Japanese Patent JP2018112752
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To transfer a pattern of a mask on a wafer with excellent accuracy by scanning exposure.SOLUTION: A controller performs scanning exposure in which a mask and a wafer W on which a pattern is formed each is relatively moved to illumination light with a Y axis direction as a scanning direction in exposure operation of the wafer W, and controls a driving system of a mask stage and a driving system of a wafer stage WST based on correction information for compensating a measurement error and measurement information of a first encoder system and a second encoder system for measuring a position of a mask stage holding the mask such that the measurement errors of the second encoder systems (64, 66, 39Y, 39Y, 39X, 39X) that measures the position of the wafer stage WST for holding the wafer W caused due to heads (64 and 66) may be compensated.SELECTED DRAWING: Figure 22
Inventors:
SHIBAZAKI YUICHI
Application Number:
JP2018051879A
Publication Date:
July 19, 2018
Filing Date:
March 20, 2018
Export Citation:
Assignee:
NIKON CORP
International Classes:
G03F7/20; G01B11/00; H01L21/68
Domestic Patent References:
| JP2006196898A | 2006-07-27 | |||
| JPH07270122A | 1995-10-20 | |||
| JPH09318321A | 1997-12-12 | |||
| JP2005217414A | 2005-08-11 | |||
| JP2006179906A | 2006-07-06 |
Foreign References:
| WO2006057263A1 | 2006-06-01 |
Attorney, Agent or Firm:
Atsushi Tateishi
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