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Patent Searching and Data


Title:
FILAMENT FOR FIXING DEVICE
Document Type and Number:
Japanese Patent JP2016065271
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a filament for fixing device, excellent in strength and durability which copes with external force such as impact or vibration even after recrystallization.SOLUTION: The filament for fixing device is a filament used for a fixing device, has a structure where neodymium oxide (hereafter referred to as "NdO" if needed) is dispersed in tungsten (hereafter referred to as "W" if needed), a deformation part containing at least curvature and flexure in at least a part, and an average diameter of 2 mm or less.SELECTED DRAWING: Figure 5

Inventors:
FUJII KOJI
ISHIBA HIROMI
KAI YUSUKE
Application Number:
JP2014193612A
Publication Date:
April 28, 2016
Filing Date:
September 24, 2014
Export Citation:
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Assignee:
NIPPON TUNGSTEN
International Classes:
C22C27/04; C22F1/18; H01J1/14
Attorney, Agent or Firm:
Mizoguchi