A fluid constituent used for etching of the multilayer film containing copper and molybdenum, and an etching method using it

Title:

A fluid constituent used for etching of the multilayer film containing copper and molybdenum, and an etching method using it

Document Type and Number:

Japanese Patent JP6135999

Kind Code:

B2

Abstract:

There is provided an etching liquid composition for a multilayer film containing copper and molybdenum. The etching liquid composition comprises: (A) a peroxosulfate ion source; (B) a copper ion source; and (C) at least one nitrogen compound source selected from the group consisting of ammonia, ammonium ions, amines, and alkyl ammonium ions and has pH 3.5 to 9.

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Inventors:

Kunio Yube
Satoshi Tamai

Application Number:

JP2013076295A

Publication Date:

May 31, 2017

Filing Date:

April 01, 2013

Export Citation:

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Assignee:

Mitsubishi Gas Chemical Co., Ltd.

International Classes:

C23F1/18; C09K13/06; C23F1/26; C23F1/34; C23F1/38; H01L21/304

Domestic Patent References:

JP2007012638A

Foreign References:

WO2011158634A1
WO2010115075A1

Attorney, Agent or Firm:

Yukitaka Nakamura
Hirohito Katsunuma
Noritaka Yokota
Mari Asano

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