Title:
METHOD FOR FORMING CONDUCTIVE CIRCUIT
Document Type and Number:
Japanese Patent JP2016195051
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for forming a conductive circuit, by which a desired pattern can be inexpensively formed by a production process different from a conventional additive process.SOLUTION: The method for forming a conductive circuit includes: a resist application step of applying a photosensitive resist on a surface of a substrate; an exposure step of irradiating the photosensitive resist with light through a patterned exposure mask; a development step of immersing the exposed substrate in an alkali solution to selectively dissolve the photosensitive resist; a conditioner step of immersing the substrate in a surfactant solution; a catalyst step of immersing the substrate in a colloid solution of Sn and Pd; an accelerator step of immersing the substrate in an acid solution; and a resist removal step of immersing the substrate in an alkali solution to dissolve the remaining photosensitive resist so as to remove a Pd catalyst layer depositing on the surface of the photosensitive resist and to leave the remaining Pd catalyst layer in a desired pattern.SELECTED DRAWING: Figure 9
Inventors:
TSUCHIYA NORITOSHI
TSUCHIYA MASAKI
TSUCHIYA MASAKI
Application Number:
JP2015074757A
Publication Date:
November 17, 2016
Filing Date:
April 01, 2015
Export Citation:
Assignee:
SHINWA IND
International Classes:
H01B13/00; C23C18/18; C23C18/31; C25D5/56; C25D7/00; G03F7/40; H05K3/18
Previous Patent: Switch
Next Patent: A manufacturing method and its manufacture device of a membrane electrode zygote with a gas diffusio...
Next Patent: A manufacturing method and its manufacture device of a membrane electrode zygote with a gas diffusio...