POLISHING PROCESSOR AND POLISHING PROCESSING METHOD

Japanese Patent JP2018111149

A

PROBLEM TO BE SOLVED: To provide: a polishing processor capable of sufficiently reducing workpiece chatters; and a polishing processing method.SOLUTION: A polishing processor 1 comprises: grinder side oscillation displacement arithmetic devices 26, 32 that obtain oscillation displacements of an abrasive wheel 23 due to oscillation in approach and alienation directions resultant from imbalance around the rotation axis of the abrasive wheel 23; spindle side oscillation displacement arithmetic devices 27, 33 that obtain oscillation displacements of a workpiece W due to the propagation of the oscillation of the abrasive wheel 23 from an abrasive wheel base 21 through a bed 10 in approach and alienation directions of the abrasive wheel 23, a relative oscillation displacement arithmetic device 34 that obtains relative oscillation displacements of the abrasive wheel 23 and those of the workpiece W on the basis of obtained oscillation displacements of the abrasive wheel 23 and those of the workpiece W; a position changing part 35 that produces position changing commands for changing a position of the abrasive wheel base 21; and a processing control part 36 that performs the polishing processing of the workpiece W on the basis of produced position changing commands.SELECTED DRAWING: Figure 1

JP4245141	Grinding device
JP3110801	Double head drill grinding machine

WATANABE AKIRA

JP2017002055A

July 19, 2018

January 10, 2017

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JTEKT CORP

B24B47/22; B23Q15/12; B23Q17/12; B24B5/02; B24B5/35; B24B41/06; B24B49/04; B24B49/10

JP2010173014A	2010-08-12
JP2011143503A	2011-07-28
JP2011161520A	2011-08-25
JP2013237127A	2013-11-28

WO2003100374A1

2003-12-04

Kobayashi Osamu
Kiichi Yamamoto
Kimura Gunji

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