Title:
研削装置
Document Type and Number:
Japanese Patent JP7378944
Kind Code:
B2
Abstract:
To provide a grinding device capable of measuring accurately a dress amount of a grinding wheel.SOLUTION: A grinding device 1 includes a whetstone spindle 22 provided with a grinding wheel 21 on a lower end, for rotating the grinding wheel 21 by driving an induction motor, a notch 53a provided on the whetstone spindle 22, a pin 53b fittable to the notch 53a, and a first sensor 25 for measuring a dress amount of the grinding wheel 21 by measuring a thickness before and after dress on a prescribed measurement position in the grinding wheel 21.SELECTED DRAWING: Figure 3
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Inventors:
Takuma Hosono
Application Number:
JP2019045269A
Publication Date:
November 14, 2023
Filing Date:
March 12, 2019
Export Citation:
Assignee:
Tokyo Seimitsu Co., Ltd.
International Classes:
B24B53/02; B24B49/18; B24B53/00; B24B53/12; H01L21/304
Domestic Patent References:
| JP2018164972A | ||||
| JP5111872A | ||||
| JP2018140459A | ||||
| JP2012121118A | ||||
| JP2009148877A | ||||
| JP2012250309A |
Attorney, Agent or Firm:
Takamitsu Shimizu
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