Title:
研削装置
Document Type and Number:
Japanese Patent JP7383118
Kind Code:
B2
Abstract:
A grinding apparatus includes a rotary table, multiple chuck, a rotational driving unit, a grinding position cover, a cleaning unit and an attachment/detachment position cover. The horizontal rotary table is configured to be rotated around a vertical rotation center line. The multiple chucks are arranged at an equal distance therebetween around the rotation center line of the rotary table. The rotational driving unit moves the chuck between an attachment/detachment position and a grinding position. The grinding position cover covers the grinding position from above and from a side. The cleaning unit is configured to supply a cleaning liquid to the chuck or the substrate at the attachment/detachment position. The attachment/detachment position cover covers the attachment/detachment position from above and from a side. The attachment/detachment position cover is provided with a transfer opening for the substrate in a side surface thereof, and accommodates therein the chuck and the cleaning unit.
Inventors:
Takaaki Wakamatsu
Application Number:
JP2022505135A
Publication Date:
November 17, 2023
Filing Date:
February 24, 2021
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
B24B55/06; B24B7/00; B24B41/06; H01L21/304
Domestic Patent References:
| JP2010251524A | ||||
| JP2012121085A | ||||
| JP202026012A | ||||
| JP200293759A |
Foreign References:
| WO2020039803A1 |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito