Title:
A grinding method of a sapphire wafer
Document Type and Number:
Japanese Patent JP6151529
Kind Code:
B2
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Inventors:
Toshiyuki Sakai
Application Number:
JP2013029628A
Publication Date:
June 21, 2017
Filing Date:
February 19, 2013
Export Citation:
Assignee:
Disco Co., Ltd.
International Classes:
B24B7/04; H01L21/304
Domestic Patent References:
| JP2001322056A | ||||
| JP57089551A | ||||
| JP2005262431A | ||||
| JP2005033111A | ||||
| JP2001358106A | ||||
| JP9038852A |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Yoshimasa Okada
Toru Kanno
Tsutomu Mizoguchi
Amada Masayuki
Yoshimasa Okada
Toru Kanno
Tsutomu Mizoguchi