Title:
エポキシ樹脂用硬化剤組成物及び一液性エポキシ樹脂組成物
Document Type and Number:
Japanese Patent JP5543879
Kind Code:
B2
More Like This:
WO/2003/022904 | NETWORK POLYMERS COMPRISING EPOXY-TERMINATED ESTERS |
JP2014227465 | LIQUID RESIN COMPOSITIONS FOR INJECTION MOLDING, AND SEMICONDUCTOR DEVICE |
JPH04126714 | EPOXY RESIN COMPOSITION |
Inventors:
Tadashi Shimura
Yoshikimi Kondo
Yoshikimi Kondo
Application Number:
JP2010197092A
Publication Date:
July 09, 2014
Filing Date:
September 02, 2010
Export Citation:
Assignee:
The Asahi Chemical イーマテリアルズ, Inc.
International Classes:
C08G59/56; C09D163/00; C09J7/00; C09J163/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito