Title:
HETERO-JUNCTION SOLAR CELL AND MANUFACTURING METHOD OF THE SAME
Document Type and Number:
Japanese Patent JP2016178332
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a hetero-junction solar cell and a manufacturing method of the same.SOLUTION: A hetero-junction solar cell comprises a semiconductor substrate, a first n-type buffer layer, a second n-type buffer layer, a first amorphous silicon semiconductor layer, a second amorphous silicon semiconductor layer, a first transparent conductive layer and a second transparent conductive layer. A super-junction solar cell manufacturing method comprises the steps of: preparing a semiconductor substrate; subsequently a first n-type buffer layer and a second n-type buffer layer are formed on a first surface and a second surface of the semiconductor substrate, respectively; subsequently, forming a first amorphous silicon semiconductor layer and a second amorphous silicon semiconductor layer on the first n-type buffer layer and the second n-type buffer layer, respectively; subsequently, forming a first transparent conductive layer and a second transparent conductive layer on the first amorphous silicon semiconductor layer and the second amorphous silicon semiconductor layer, respectively; and lastly, installing a first conducting wire and a second conducting wire on the first transparent conductive layer and the second transparent conductive layer, respectively.SELECTED DRAWING: Figure 2
Inventors:
CHEN PENG
Application Number:
JP2016114297A
Publication Date:
October 06, 2016
Filing Date:
June 08, 2016
Export Citation:
Assignee:
NEO SOLAR POWER CORP
International Classes:
H01L31/0747
Domestic Patent References:
| JP2014506005A | 2014-03-06 | |||
| JP2014072406A | 2014-04-21 | |||
| JP2001189478A | 2001-07-10 | |||
| JP2007227692A | 2007-09-06 |
Foreign References:
| WO2012043124A1 | 2012-04-05 |
Attorney, Agent or Firm:
Patent Business Corporation Unias International Patent Office
Previous Patent: 基地局及びユーザ装置
Next Patent: A plastic molding type semiconductor device and a manufacturing method for the same
Next Patent: A plastic molding type semiconductor device and a manufacturing method for the same