Title:
RESIN SEALED TYPE SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2016178333
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin sealed type semiconductor device that is adaptive to multiple pins and has a high reliability, and to provide a method of manufacturing such a resin sealed type semiconductor device more easily with stability.SOLUTION: A resin sealed type semiconductor device is configured to have: a circuit part that comprises a plurality of terminal parts each comprising an internal terminal surface and an external terminal surface front and rear integrally, so that the external terminal surfaces form one flat plane; a semiconductor element electrically connected with internal terminal surfaces of the terminal parts by a wire; and a resin member that encapsulates the terminal parts, the semiconductor element, and the wire in a state where at least the external terminal surfaces of the terminal parts are exposed. Each terminal part is configured to have a base, and a surface noble metal layer that configures the internal terminal surface, and have at least one of a recessed part and a rough surface on a side wall surface of the base.SELECTED DRAWING: Figure 15
Inventors:
MATSUMORI MASAAKI
SEKI KENTARO
SEKI KENTARO
Application Number:
JP2016114372A
Publication Date:
October 06, 2016
Filing Date:
June 08, 2016
Export Citation:
Assignee:
DAINIPPON PRINTING CO LTD
International Classes:
H01L23/28; H01L21/56; H01L23/12; H01L23/50
Domestic Patent References:
| JP2009164232A | 2009-07-23 | |||
| JP2009135417A | 2009-06-18 | |||
| JP2004119726A | 2004-04-15 | |||
| JP2011176364A | 2011-09-08 | |||
| JP2003037221A | 2003-02-07 | |||
| JP2011151069A | 2011-08-04 | |||
| JP2009099871A | 2009-05-07 |
Foreign References:
| WO2006009030A1 | 2006-01-26 |
Attorney, Agent or Firm:
Junzo Yoneda
Masataka Ota
Masataka Ota