Title:
An image pick-up module with an insulation tube, an image pick-up module with a lens, and an endoscope
Document Type and Number:
Japanese Patent JP6012842
Kind Code:
B2
Abstract:
An imaging module of the invention includes: an electrical cable; a solid-state image sensing device; and a three-dimensional wiring base in which a mount surface is provided on a molded product. The mount surface has two opposed apexes which sandwich a central portion therebetween and is molded so that the distance between the two apexes is the longest in distances between two points on sides of the mount surface, a cross section parallel to the mount surface of the three-dimensional wiring base is equal to the mount surface or smaller than the mount surface, and the distance between two points that is the longest in distances on sides of a shape in a plan view of the solid-state image sensing device is equal to or shorter than the distance between the two apexes.
Inventors:
Hideyuki Wada
Kenichi Nakadate
Kenichi Nakadate
Application Number:
JP2015500282A
Publication Date:
October 25, 2016
Filing Date:
February 13, 2014
Export Citation:
Assignee:
Fujikura Ltd.
International Classes:
A61B1/04; G02B23/24; H04N5/225
Domestic Patent References:
JPS63155016A | 1988-06-28 | |||
JPS63118120A | 1988-05-23 | |||
JPS6298318A | 1987-05-07 | |||
JP2009027709A | 2009-02-05 | |||
JP2013211629A | 2013-10-10 | |||
JP2008237732A | 2008-10-09 | |||
JP2000209472A | 2000-07-28 |
Attorney, Agent or Firm:
Masatake Shiga
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu
Sumio Tanai
Mitsunaga Igarashi
Toshio Komuro
Yuichiro Shimizu
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