Title:
INTERMEDIATE BODY OF PRINTED WIRING BOARD AND MANUFACTURING METHOD FOR PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2017011188
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an intermediate body of a printed wiring board capable of preventing a coverlay film from melting due to a chemical, without increasing the number of the process in the way of manufacturing process, and to provide a manufacturing method for a printed wiring board.SOLUTION: An intermediate body 100 of a printed wiring board includes a flexible region A where a circuit pattern 2 is formed on at least one side of an inner core layer 1, and the surface of the circuit pattern 2 is coated with a coverlay film 3, and a rigid region B where the circuit pattern 2 is formed on at least one side of the inner core layer 1, the surface of the circuit pattern 2 is coated with the coverlay film 3, at least one outer core layer 10 is laminated on the surface of the coverlay film 3 via a prepreg 4, and a through hole 6 is formed. Out of the outer core layer 10 in the rigid region B, the outer core layer 10 in close proximity to the surface of the coverlay film 3 is applied removably from the surface of the coverlay film 3 in close proximity in the flexible region A.SELECTED DRAWING: Figure 1
Inventors:
KATO KATSUMUNE
Application Number:
JP2015127025A
Publication Date:
January 12, 2017
Filing Date:
June 24, 2015
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
H05K3/46
Domestic Patent References:
| JPH0730210A | 1995-01-31 | |||
| JPH06252559A | 1994-09-09 | |||
| JPH09331153A | 1997-12-22 | |||
| JPH06334278A | 1994-12-02 |
Attorney, Agent or Firm:
Toshikazu Fukai
Yosuke Tsushima
Waseda Shigeyuki
Yosuke Tsushima
Waseda Shigeyuki
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