Title:
SEMICONDUCTOR DEVICE AND INFORMATION PROCESSING DEVICE
Document Type and Number:
Japanese Patent JP2017011187
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To shorten wiring that connects between semiconductor elements.SOLUTION: A semiconductor device includes: a substrate 20 having a first surface and second surface; a first semiconductor element 11 and second semiconductor element 12 mounted on the first surface; and a third semiconductor element 14 mounted on the second surface, having a plurality of sides including a first side 46 and a second side 47 opposite to the first side, and connecting the first semiconductor element and second semiconductor element. The first semiconductor element overlaps with only the first side out of the plurality of sides, and the second semiconductor element overlaps with only the second side out of the plurality of sides.SELECTED DRAWING: Figure 2
Inventors:
TOMITA YASUMOTO
Application Number:
JP2015127018A
Publication Date:
January 12, 2017
Filing Date:
June 24, 2015
Export Citation:
Assignee:
FUJITSU LTD
International Classes:
H01L25/065; H01L25/04; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Shuhei Katayama