Title:
A laser beam machining device and a processing-conditions setting method of a substrate with a pattern
Document Type and Number:
Japanese Patent JP6064519
Kind Code:
B2
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Inventors:
Yuma Iwatsubo
Koji Igawa
Nagatomo Shohei
Ikusho Nakatani
Naoya Kiyama
Koji Igawa
Nagatomo Shohei
Ikusho Nakatani
Naoya Kiyama
Application Number:
JP2012237738A
Publication Date:
January 25, 2017
Filing Date:
October 29, 2012
Export Citation:
Assignee:
Samsung Diamond Industry Co., Ltd.
International Classes:
B23K26/53; B23K26/00; B23K26/03; B23K26/08; B23K26/70; B28D5/00; H01L21/301
Domestic Patent References:
| JP2014111275A | ||||
| JP2014225691A | ||||
| JP2014216556A | ||||
| JP2014087833A | ||||
| JP2014069237A | ||||
| JP2012051036A |
Attorney, Agent or Firm:
Yoshitake Hidetoshi
Takahiro Arita
Takahiro Arita
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