Title:
ELECTRONIC COMPONENT, SUBSTRATE FOR MOUNTING ELECTRONIC CIRCUIT ELEMENT AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3214507
Kind Code:
B2
Abstract:
PURPOSE: To mount internal conductive electrodes, external conductive electrodes and a die pad easily on an electric circuit wiring board with high accuracy by a method wherein the internal conductive electrodes, the external conductive electrodes or one part of the die pad is provided in such a way as to penetrate a heat-resistant resin film.
CONSTITUTION: A base copper layer 20 is applied on the surface of a heat- resistant resin film 11, a mask 21 is put on the other surface 11b of the film 11 and a hole, in which internal conductive electrodes 13, external conductive electrodes 14, a through electrode 16 in a die pad 15 and the like can be formed, is opened in the film 11. A mask is put on the surface of the layer 20 and a plating is applied to provide a substrate 10 for electronic circuit element mounting use formed with conductive leads 12, through which the electrodes 13 and 14 are connected to each other, the die pad 15 and the electrode 16 and at the same time, an IC chip 2 is mounted on the pad 15. Accordingly, the electrodes 14 are held by the film at constant intervals and measurement inspection and shipment inspection of electronic component before and after mounting, specially semiconductor devices, can be efficiently made.
Inventors:
Hideharu Yamamoto
Application Number:
JP26076291A
Publication Date:
October 02, 2001
Filing Date:
October 08, 1991
Export Citation:
Assignee:
ソニー株式会社
International Classes:
H01L21/60; (IPC1-7): H01L21/60
Domestic Patent References:
| JP4254366A |
Attorney, Agent or Firm:
Osamu Matsumura