Title:
発光装置
Document Type and Number:
Japanese Patent JP7311301
Kind Code:
B2
Abstract:
To provide a light-emitting device capable of sufficiently performing mechanical fixing and airtight sealing and capable of reducing an area required for welding and a manufacturing method of the same.SOLUTION: The light-emitting device includes a substrate 11, a submount 15 mounted on the substrate 11, a semiconductor laser element 16 mounted on the submount 15, and a sealing lid 12 provided on the substrate 11 to cover the submount 15 and the semiconductor laser element 16. A joint portion 11a of the substrate 11 and the sealing lid 12 are joined by a first solder material 18. The joint portion 11a has a shape extending at least in a height direction of the substrate 11.SELECTED DRAWING: Figure 1
Inventors:
Kiyoto Goto
Yuji Takizawa
Ippei Yamaguchi
Yuji Takizawa
Ippei Yamaguchi
Application Number:
JP2019079960A
Publication Date:
July 19, 2023
Filing Date:
April 19, 2019
Export Citation:
Assignee:
Sharp Corporation
International Classes:
H01S5/02208; H01L23/02
Domestic Patent References:
| JP11097804A | ||||
| JP2013222726A | ||||
| JP2004111571A | ||||
| JP63025988A | ||||
| JP2015041654A | ||||
| JP2014150098A |
Foreign References:
| WO2018030486A1 | ||||
| US4953006 |
Attorney, Agent or Firm:
Patent Attorney Corporation ARK Office