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Patent Searching and Data


Title:
A manufacture device and an assembly line formation method of wire harness
Document Type and Number:
Japanese Patent JP6206923
Kind Code:
B2
Inventors:
Kenji Nakano
Kenji Yamaguchi
Katsumi Nagatomo
Yasunori Sakamoto
Kuroki Isaichi
Masahide Tanaka
Application Number:
JP2014051032A
Publication Date:
October 04, 2017
Filing Date:
March 14, 2014
Export Citation:
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Assignee:
Yazaki Corporation
International Classes:
H01B13/012
Domestic Patent References:
JP2117613U
JP63114704U
Attorney, Agent or Firm:
Fumio Takino
Hideo Takino
Takao Kawasaki
Toshiaki Tsuda
Masashi Torino
Park Ji-un