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Title:
MANUFACTURING METHOD FOR FPC INCLUDING ELECTROMAGNETIC WAVE SHIELD MATERIAL
Document Type and Number:
Japanese Patent JP2017017327
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method for an FPC including an electromagnetic wave shield material for FPC, which is rich in flexibility and thin, and is excellent in the flexing characteristics so that the electromagnetic wave shield performance does not degrade even after repetition of severe bending motion.SOLUTION: In a manufacturing method for an FPC 10 including an electromagnetic wave shield material for FPC used in an electronic apparatus, the electromagnetic wave shield material for FPC consisting of a laminate, where a base material 1 made of at least a dielectric thin resin film, an adhesive layer 2 of thin film, a conductive paste layer 3 before calcination, and a conductive adhesive layer 4, are laminated in order, is pasted to a FPC7 via the conductive adhesive layer 4, and then the electromagnetic wave shield material for FPC and the FPC7 are heated and crimped simultaneously, while firing the conductive paste layer 3 with them compressing.SELECTED DRAWING: Figure 1

Inventors:
NOMURA NAOHIRO
TAKEYAMA SANAE
SAKURAGI TAKANORI
INABA YUKO
GOTO NOBUHIRO
KOKUNI MORITOSHI
Application Number:
JP2016160657A
Publication Date:
January 19, 2017
Filing Date:
August 18, 2016
Export Citation:
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Assignee:
FUJIMORI KOGYO CO
International Classes:
H05K9/00; B32B7/02; H01B5/14; H01B5/16; H01B13/00; H05K1/02
Domestic Patent References:
JP5940279B22016-06-29
JP2004095566A2004-03-25
JP2003188574A2003-07-04
JP2016099700A2016-05-30
Attorney, Agent or Firm:
Masatake Shiga
Kazunori Onami
Tomoyuki Teihiro