A manufacturing method of electric conduction particles, anisotropic conductive adhesives, a connection structure, and electric conduction particles

Japanese Patent JP5975054

B2

Provided is a conductive particle, an anisotropic conductive adhesive which can achieve both low conduction resistance and high insulation reliability when used as conductive particles blended into anisotropic conductive adhesives and can maintain a low electrical resistance value even when highly compressed, a connection structure, and a manufacturing method thereof. According to the present invention, the conductive particle comprises a resin particle and a metal layer installed on the surface of the resin particle. The metal layer includes a first layer including copper or nickel and copper and a second layer including nickel in the order close to the resin particle. The metal layer includes grains containing palladium having a length of 4 nm or more in the thickness direction of the metal layer and a projection is formed on the outer surface of the metal layer.

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JPS6012753	[Title of the device] Compound trolley line
WO/2009/133897	CONNECTING MATERIAL AND SEMICONDUCTOR DEVICE

Yoshinori Ejiri
Masayuki Nakagawa
Kunihiko Akai
Taizo Yamamura
Yasushi Watanabe
Enomoto Nana
Mitsuharu Matsuzawa
Matsuzaki Toshiaki

JP2014046382A

August 23, 2016

March 10, 2014

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Hitachi Chemical Co., Ltd.

H01B5/00; H01B1/00; H01B1/22; H01B5/16; H01B13/00; H01R11/01

JP2010027569A

Yoshiki Hasegawa
Yoshinori Shimizu
Tomoya Furoshita
Hiromitsu Nakayama

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