Title:
METHOD FOR MANUFACTURING ELEMENT CHIP
Document Type and Number:
Japanese Patent JP2018056178
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing an element chip forming a resist pattern on a substrate held by a holding tape and, subsequently, etching the substrate with plasma.SOLUTION: A method for manufacturing an element chip includes: a step of preparing a substrate having a first surface and a second surface opposite to the first surface and having a plurality of element regions and division regions defining the element regions, with the second surface held by a holding tape; a step of producing particles by spraying resist solution containing a resist component and a solvent; a step of forming a resist film by volatilizing the solvent from the particles and, subsequently, depositing the resist component on the first surface of the substrate held by the holding tape; a patterning step of patterning the resist film and exposing the division regions on the first surface of the substrate; and a step of etching the division regions from the first surface with plasma.SELECTED DRAWING: Figure 3
Inventors:
MATSUBARA ISAYUKI
Application Number:
JP2016187024A
Publication Date:
April 05, 2018
Filing Date:
September 26, 2016
Export Citation:
Assignee:
PANASONIC IP MAN CORP
International Classes:
G03F7/26; H01L21/027; H01L21/301; H01L21/3065
Domestic Patent References:
JP2007156465A | 2007-06-21 | |||
JP2003297725A | 2003-10-17 | |||
JP2012235130A | 2012-11-29 | |||
JP2007079589A | 2007-03-29 | |||
JP2006106783A | 2006-04-20 | |||
JP2007073916A | 2007-03-22 | |||
JP2007019385A | 2007-01-25 | |||
JP2015201562A | 2015-11-12 | |||
JP2014230185A | 2014-12-08 | |||
JP2002527795A | 2002-08-27 |
Foreign References:
US20150255349A1 | 2015-09-10 | |||
US20150221505A1 | 2015-08-06 |
Attorney, Agent or Firm:
Shinichi Kawasaki
Yuko Tsumura
Yuko Tsumura
Previous Patent: A manufacturing method of an inductor and an inductor
Next Patent: Coil part article
Next Patent: Coil part article