Title:
MANUFACTURING METHOD OF ELECTRONIC AND ELECTRIC COMPONENT AND EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2017088718
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic and electric component good in appearance and having high quality and high credibility without voids or the like at good productivity easily and an epoxy resin composition used in the method.MEANS: There is provided a manufacturing method of an electronic and electric component having a process for preparing a liquid epoxy resin composition containing following (A) to (G) components (pts.mass), a semi-hardening process for arranging an electronic and electric component element in a molding mold and semi-hardening the epoxy resin composition in the molding mold and a post-curing process for completely curing the epoxy resin composition by post-curing after opening the molding mold. (A) an epoxy resin (100). (B) acid anhydride (50 to 150). (C) spherical alumina (700 to 1100). (D) aluminum hydroxide (20 to 50). (E) hydrophilic fumed silica (4 to 10). (F) an aminosilane coupling agent (0.1 to 2). (G) a curing accelerator (0.1 to 10).SELECTED DRAWING: None
Inventors:
WATANABE YOSHIZO
FUJIURA HIROSHI
ASANO YUKARI
TSUNODA REI
FUJIURA HIROSHI
ASANO YUKARI
TSUNODA REI
Application Number:
JP2015219450A
Publication Date:
May 25, 2017
Filing Date:
November 09, 2015
Export Citation:
Assignee:
KYOCERA CORP
International Classes:
C08G59/20
Attorney, Agent or Firm:
Patent Business Corporation Sakura International Patent Office
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