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Title:
METHOD FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD AND APPARATUS FOR MANUFACTURING FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2018010910
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for manufacturing a flexible printed wiring board which achieves enhancement of productivity, and to provide an apparatus for manufacturing a flexible printed wiring board.SOLUTION: A method for manufacturing a flexible printed wiring board includes: a first step of holding a plurality of intermediate products between a pair of holding members 110 and 120 having a plurality of insertion holes formed on at least one thereof in a state of sandwiching the plurality of intermediate products between the holding members; and a second step of pushing a push-in plate 500 of which a tip is structured of a curved surface from the insertion holes, subjecting the plurality of intermediate products to a bending work, and holding the push-in plate 500 with respect to the pair of holding members 110 and 120; and a third step of repeating the second step by using the plurality of push-in plates 500, and then heating the plurality of intermediate products and the plurality of push-in plates 500 to such a temperature that a thermoplastic resin is softened in a state in which the intermediate products and the push-in plates are held by the pair of holding members 110 and 120.SELECTED DRAWING: Figure 1

Inventors:
NARUSAWA YOSHIHIKO
Application Number:
JP2016137298A
Publication Date:
January 18, 2018
Filing Date:
July 12, 2016
Export Citation:
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Assignee:
NIPPON MEKTRON KK
International Classes:
H05K3/00; H05K1/02
Domestic Patent References:
JP2015207585A2015-11-19
JP2012231018A2012-11-22
JP2011134884A2011-07-07
JP2016021555A2016-02-04
JP2010264495A2010-11-25
Attorney, Agent or Firm:
Kazunobu Sera
Yoshiyuki Kawaguchi
Hiroyasu Kanai
Koichiro Sakai
Ryota Morihiro