The manufacturing method of a hardening object and a hardening object, a layered product, a printed wired board, and a semiconductor device

Japanese Patent JP6225422

B2

PROBLEM TO BE SOLVED: To materialize a hardened body causing sufficient dry film adhesion and having a small surface undulation even in the case of using a thin resin composition layer for thinning a layer and to suppress generation of unevenness in roughness when manufacturing a printed wiring board.SOLUTION: The hardened body 2 provided on a circuit board 5 is obtained by laminating a resin composition layer on a circuit board 3 and thermally hardening the resin composition layer. In the hardened body, when the lowest melting viscosity temperature in the resin composition layer is set as Tv (°C), the lamination temperature of the resin composition layer is Tv-35°C to Tv+35°C, and when the thickness of the resin composition layer and the thickness of the hardened body on the circuit wiring of the circuit board are set as x (μm) and y (μm) respectively, 0.3