Title:
A manufacturing method of a luminescent device, and a luminescent device
Document Type and Number:
Japanese Patent JP6149487
Kind Code:
B2
Abstract:
A manufacturing method of a light emitting device includes a light emitting element disposed over a substrate and a reflective resin disposed along the side surface of the light emitting element. The method includes disposing light emitting elements in a matrix over an aggregate substrate, and disposing a semiconductor element between the adjacent light emitting elements in one direction of column and row directions of the light emitting elements in the matrix. A reflective resin is disposed to cover the semiconductor elements along the side surfaces of the light emitting elements and the side surfaces of the phosphor layers. The reflective resin and the substrate disposed in between the adjacent light emitting elements is cut in the column or row direction and between the light emitting element and the adjacent semiconductor element in the other direction, to include a light emitting element or a semiconductor element.
Inventors:
Masashi Ishida
Daisuke Sato
Daisuke Sato
Application Number:
JP2013090508A
Publication Date:
June 21, 2017
Filing Date:
April 23, 2013
Export Citation:
Assignee:
Nichia Corporation
International Classes:
H01L33/60; H01L33/50
Domestic Patent References:
| JP2012099544A | ||||
| JP2007266408A | ||||
| JP2001274006A | ||||
| JP2012156443A | ||||
| JP2010219324A | ||||
| JP2012059939A | ||||
| JP2012015438A |
Foreign References:
| WO2009069671A1 | ||||
| US20080179503 | ||||
| WO2011021402A1 | ||||
| US20120074432 |
Attorney, Agent or Firm:
Samejima Mutsumi
Keiichi
Keiichi