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Patent Searching and Data


Title:
PRESSURE SENSOR MODULE AND METHOD FOR MANUFACTURING PRESSURE SENSOR MODULE
Document Type and Number:
Japanese Patent JP2017166873
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a pressure sensor module with which it is possible to prevent a change over time of the deformation characteristic of a diaphragm when maintaining the position of the diaphragm in a state of being unconnected to a base.SOLUTION: The pressure sensor module comprises: a base having a first concave part 32A and a first receiving surface part 34A extending from an open edge of the first concave part 32A to the outside; a first diaphragm body 14A arranged facing the first receiving surface part 34A and forming a first pressure chamber 46A between the first concave part 32A and itself; a first cylindrical body 16A arranged opposite the first concave part 32A across the first diaphragm body 14A and held to the base 12; and a pressure sensor element 18 for detecting pressure propagated via the inside of the pressure chamber 46A from the first diaphragm body 14A. The first cylindrical body 16A is placed against the outer circumference of the first diaphragm body 14A and joined to the outer circumference of the first diaphragm body 14A.SELECTED DRAWING: Figure 3

Inventors:
KANEKO YASUAKI
OTA MASAKI
TSUDA HITOSHI
Application Number:
JP2016050180A
Publication Date:
September 21, 2017
Filing Date:
March 14, 2016
Export Citation:
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Assignee:
TGK CO LTD
International Classes:
G01L19/06; H01L29/84
Attorney, Agent or Firm:
Sakaki Morishita
Yusuke Murata
Tomoyuki Miki