Title:
PRESSURE SENSOR MODULE AND CONNECTION STRUCTURE OF PRESSURE SENSOR MODULE
Document Type and Number:
Japanese Patent JP2017166872
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a technique with which it is possible to prevent a change in the pressure transmission characteristic of a pressure chamber caused by a displacement of a seal member sealing the pressure chamber.SOLUTION: A pressure sensor module of the present invention comprises: a base 12 having a hollow part 30; a diaphragm body 14 for demarcating a pressure chamber 42 inside the hollow part 30; a hollow structure 16 for demarcating an introduction channel 46 through which a fluid to be measured is introduced on an opposite side to the pressure chamber 42 across the diaphragm body 14; a pressure sensor element 18 for detecting pressure propagated via the first diaphragm body 14A and the pressure chamber 42 from the introduction channel 46; and a first seal material 22 for sealing the pressure chamber 42. The first seal material 22 is arranged at a position that separates between a space into which the fluid to be measured is introduced and the pressure chamber 42.SELECTED DRAWING: Figure 3
Inventors:
KANEKO YASUAKI
OTA MASAKI
TSUDA HITOSHI
OTA MASAKI
TSUDA HITOSHI
Application Number:
JP2016050179A
Publication Date:
September 21, 2017
Filing Date:
March 14, 2016
Export Citation:
Assignee:
TGK CO LTD
International Classes:
G01L19/06; H01L29/84
Attorney, Agent or Firm:
Sakaki Morishita
Yusuke Murata
Tomoyuki Miki
Yusuke Murata
Tomoyuki Miki
Previous Patent: Pressure sensor module
Next Patent: A manufacturing method of a pressure sensor module and a pressure sensor module
Next Patent: A manufacturing method of a pressure sensor module and a pressure sensor module