A manufacturing method of a solid-state image sensing device and a solid-state image sensing device, and electronic equipment

Title:

A manufacturing method of a solid-state image sensing device and a solid-state image sensing device, and electronic equipment

Document Type and Number:

Japanese Patent JP6245474

Kind Code:

B2

Abstract:

There is provided a solid-state imaging device including a first substrate having a pixel circuit including a pixel array unit formed thereon, and a second substrate having a plurality of signal processing circuits formed thereon so as to be arranged through a scribe region. The first substrate and the second substrate are stacked.

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Inventors:

Kunihiko Izumihara

Application Number:

JP2014129952A

Publication Date:

December 13, 2017

Filing Date:

June 25, 2014

Export Citation:

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Assignee:

ソニー株式会社

International Classes:

H01L21/3205; G03F7/20; H01L21/027; H01L21/768; H01L23/522; H01L25/065; H01L25/07; H01L25/18; H01L27/146; H04N5/341; H04N5/374

Domestic Patent References:

JP201171958A
JP2006197192A
JP2013182943A
JP2006270292A

Foreign References:

WO2012155142A1

Attorney, Agent or Firm:

Takashi Nishikawa
Yoshio Inamoto

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