Title:
PROCESS FOR MANUFACTURING CHIP-CARD MODULE WITH SOLDERED ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2022074124
Kind Code:
A
Abstract:
To contribute at least partially to improvement of processes for manufacturing chip-card modules comprising components in addition to a conventionally produced chip.SOLUTION: The invention relates to a process for manufacturing a chip-card module, the process including one or more steps in which a meltable solder is deposited on connection pads (16) formed in a layer of electrically conductive material located on the back side of a dielectric substrate (9), and at least one electronic component is connected to these connection pads (16) by reflowing the solder. The invention relates to a chip-card module obtained using this process. The invention relates to a chip card including such a module.SELECTED DRAWING: Figure 4
More Like This:
| JP2015002322 | ELECTRONIC DEVICE |
| JP3643476 | SEMICONDUCTOR DEVICE AND ITS MANUFACTURE |
| JPH06169059 | COIN-TYPE INTEGRATED CIRCUIT |
Inventors:
CHIRISTOPHE MATHIEU
GUILLAUME GIMBERT
GUILLAUME GIMBERT
Application Number:
JP2021177763A
Publication Date:
May 17, 2022
Filing Date:
October 29, 2021
Export Citation:
Assignee:
LINXENS HOLDING
International Classes:
H01L25/18; G06K19/077; H01L21/60
Attorney, Agent or Firm:
Murayama Yasuhiko
Shinya Mihiro
Tatsuhiko Abe
Shinya Mihiro
Tatsuhiko Abe