A method of preparing the outer surface of a planar waveguide so that a target sample can be bonded along a plurality of predetermined lines and a planar waveguide.

Japanese Patent JP6358476

B2

A method for preparing the outer surface (11) of a planar waveguide (1) for binding target samples along a plurality of predetermined lines (4). The method comprises sequentially applying at least one plurality of linker molecules (2, 5) to the outer surface (11) of a planar waveguide (1) adapted for attachment of a head group (21) of a linker molecule (2) to the outer surface (11) to form an individual layer of linker molecules (2, 5) with individual layers formed one above the other starting from the outer surface (11) of the planar waveguide (1). Each linker molecule (2, 5) comprises a functional group (22, 52) and the head group (21, 51) which is capable of attaching to the outer surface (11) of the planar waveguide (1) or to the functional groups (22) of the preceding layer of linker molecules (2). The functional groups of the uppermost layer are bound to photo-labile protecting groups (3). Exposing those groups (3) of the uppermost layer arranged along a plurality of predetermined lines (4) to light of a predetermined wavelength removes the exposed photo-labile groups (3) from the functional groups (52) to make these functional groups (52) capable of attaching a complementary functional group of a further molecule.

Fattinger, Christoph

JP2015553094A

July 18, 2018

January 17, 2014

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F.HOFFMANN-LA ROCHE AG

G01N33/543; G02B6/13

JP2005520163A
JP6504997A
JP2007298523A
JP2012168165A
JP2007040974A
JP2010066134A
JP2010537168A

US20060057729
US20030032043

Patent business corporation Matsubara and Muraki International Patent Office

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