Title:
貫通電極型ウィルキンソン電力分配器のための方法、構造体及び設計構造体
Document Type and Number:
Japanese Patent JP5613244
Kind Code:
B2
Abstract:
A method, structure, and design structure for a through-silicon-via Wilkinson power divider. A method includes: forming an input on a first side of a substrate; forming a first leg comprising a first through-silicon-via formed in the substrate, wherein the first leg electrically connects the input and a first output; forming a second leg comprising a second through-silicon-via formed in the substrate, wherein the second leg electrically connects the input and a second output, and forming a resistor electrically connected between the first output and the second output.
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Inventors:
ディン、ハンイ
ジョセフ、アルビン、ジェイ
ウッズ、ウェイン、エイチ
ジョセフ、アルビン、ジェイ
ウッズ、ウェイン、エイチ
Application Number:
JP2012526824A
Publication Date:
October 22, 2014
Filing Date:
August 12, 2010
Export Citation:
Assignee:
インターナショナル・ビジネス・マシーンズ・コーポレーションＩＮＴＥＲＮＡＴＩＯＮＡＬ ＢＵＳＩＮＥＳＳ ＭＡＣＨＩＮＥＳ ＣＯＲＰＯＲＡＴＩＯＮ
International Classes:
H01P5/19; H01P11/00
Attorney, Agent or Firm:
Tsuyoshi Ueno
Tasa Kind 1
About a city Yoshihiro
Tasa Kind 1
About a city Yoshihiro