Title:
取付構造体
Document Type and Number:
Japanese Patent JP7402097
Kind Code:
B2
Abstract:
To suppress a gap between joined frame bodies.SOLUTION: A mounting structure has a support structure including: a first frame body and a second frame body each having a plate-like frame plate portion, a plate-like receiving plate portion projecting from the frame plate portion, and a locking portion opposed to the frame plate portion with a space and provided at a position away from the receiving plate portion; and a support structure having a plate-like fixed portion and a first projecting plate and a second projecting plate that are two plate-like portions projecting from the fixed portion and extending in a direction intersecting with each other. With the support structure, in a state where a part of the first projecting plate is disposed between the frame plate portion of the first frame body and the locking portion and part of the second projecting plate is disposed between the frame plate portion of the second frame body and the locking portion, the fixed portion is fixed relative to the receiving plate portion and the first frame body and the second frame body are connected.SELECTED DRAWING: Figure 6
Inventors:
Masaaki Ueki
Application Number:
JP2020055309A
Publication Date:
December 20, 2023
Filing Date:
March 26, 2020
Export Citation:
Assignee:
QUALCOMM ATHEROS, INC.
International Classes:
G09F9/00; H04N5/64
Domestic Patent References:
| JP2008065335A | ||||
| JP2005087502A | ||||
| JP11146305A | ||||
| JP2005034411A | ||||
| JP3013517U |
Foreign References:
| US20160109907 |
Attorney, Agent or Firm:
Tomoya Inoue
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