Title:
A negative type photosensitive resin composition, a pattern formation method, a hardening film, an insulating film, a color filter, and a display
Document Type and Number:
Japanese Patent JP6080759
Kind Code:
B2
Abstract:
Provided are: a negative-type photosensitive resin composition capable of forming a pattern having favorable adhesiveness at a low light exposure; a pattern forming method using the negative-type photosensitive resin composition; a cured film, an insulating film, and a color filter formed using the negative-type photosensitive resin composition; and a display device provided with the cured film, insulating film, or color filter. The negative-type photosensitive resin composition according to the present invention contains a compound represented by the following formula (1). In the formula, R 1 and R 2 each independently indicate a hydrogen atom or an organic group, but at least one indicates an organic group. R 1 and R 2 may be bonded to form a ring structure and may contain a hetero atom bond. R 3 indicates a single bond or an organic group. R 4 to R 9 each independently indicate a hydrogen atom, an organic group, etc., but R 6 and R 7 are never hydroxyl groups. R 10 indicates a hydrogen atom or an organic group.
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Inventors:
Shioda Dai
Kuroko Mayumi
Kunihiro Noda
Keisuke Tadokoro
Kuroko Mayumi
Kunihiro Noda
Keisuke Tadokoro
Application Number:
JP2013521552A
Publication Date:
February 15, 2017
Filing Date:
June 15, 2012
Export Citation:
Assignee:
Tokyo Ohka Kogyo Co., Ltd.
International Classes:
G03F7/004; G02B5/20; G03F7/027; G03F7/033; G03F7/038
Domestic Patent References:
| JP2011095635A | ||||
| JP53090387A | ||||
| JP2275453A | ||||
| JP8127572A |
Foreign References:
| WO2010113813A1 |
Attorney, Agent or Firm:
Masayuki Masabayashi