Title:
A pattern formation method and a manufacturing method of an electronic devide
Document Type and Number:
Japanese Patent JP6134603
Kind Code:
B2
Abstract:
There are provided a pattern forming method which satisfies high sensitivity, high resolving power at the time of isolated line pattern formation, a good pattern shape, and high dry etching resistance at the same time, an actinic ray sensitive or radiation sensitive resin composition and a resist film which are provided thereto, a method for manufacturing an electronic device using these, and an electronic device by using a pattern forming method including step (1) of forming a film using the actinic ray sensitive or radiation sensitive resin composition containing a resin (Ab) having a repeating unit represented by the specific General Formula (Ab1), step (2) of exposing the film, and step (4) of performing development using a developer including an organic solvent after exposing and of forming a negative type pattern, in this order.
Inventors:
Hirano Osamu
Hiroo Takizawa
Hiroo Takizawa
Application Number:
JP2013161903A
Publication Date:
May 24, 2017
Filing Date:
August 02, 2013
Export Citation:
Assignee:
FUJIFILM Corporation
International Classes:
G03F7/038; G03F7/039
Domestic Patent References:
| JP2013076060A | ||||
| JP2005250212A | ||||
| JP2003316007A | ||||
| JP2014115569A | ||||
| JP2013092723A | ||||
| JP2011221513A |
Foreign References:
| WO2003075092A1 |
Attorney, Agent or Firm:
Patent Business Corporation Koei Patent Office
Takeshi Takamatsu
Toshiyuki Ozawa
Takeshi Takamatsu
Toshiyuki Ozawa