Title:
PHOTOSENSITIVE THERMOSETTING RESIN COMPOSITION AND FLEXIBLE PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2018106198
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide an alkali development type thermosetting resin composition which is excellent in reliability such as impact resistance and flexibility, working accuracy and workability, and is suitable for a collective formation process of an insulating film of a flexible printed wiring board, in particular, a folded portion (bent portion) and a mounted portion (non-bent portion).SOLUTION: A photosensitive thermosetting resin composition contains (A) a polyimide resin having an imide ring and a carboxyl group, (B) a resin having a phenolic hydroxyl group, (C) a photo-base generator, and (D) a thermosetting component.SELECTED DRAWING: Figure 1
Inventors:
MIYABE HIDEKAZU
HAYASHI AKIRA
YOKOYAMA YUTAKA
KOIKE NAOYUKI
HAYASHI AKIRA
YOKOYAMA YUTAKA
KOIKE NAOYUKI
Application Number:
JP2018041156A
Publication Date:
July 05, 2018
Filing Date:
March 07, 2018
Export Citation:
Assignee:
TAIYO INK MFG CO LTD
International Classes:
G03F7/004; G03F7/038; H05K3/28
Domestic Patent References:
| JP2009258471A | 2009-11-05 | |||
| JP2010256881A | 2010-11-11 | |||
| JP2012091430A | 2012-05-17 | |||
| JP2011017897A | 2011-01-27 |
Attorney, Agent or Firm:
Ichiro Honda
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro
Yumiko Sugimoto
Watari Takumi
Takashi Otaguro