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Title:
A plasma treatment apparatus and a plasma processing method
Document Type and Number:
Japanese Patent JP6064174
Kind Code:
B2
Abstract:
To provide a plasma processing device and a plasma processing method capable of generating plasma stably and efficiently and processing the entire desired treated region of a substrate efficiently for a short period of time.

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Inventors:
Tomohiro Okumura
Hiro Kawaura
Application Number:
JP2014536582A
Publication Date:
January 25, 2017
Filing Date:
September 11, 2013
Export Citation:
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Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
H05H1/30; H01L21/20; H01L21/22; H01L21/324; H05H1/24
Domestic Patent References:
JP5510437B2
JP5467371B2
JP2004047192A
JP58045736A
JP2007294414A
JP2006332055A
JP11251090A
JP2012174500A
JP2007287454A
JP2009283435A
JP2008537282A
JP2001093871A
Foreign References:
WO2011142125A1
US20120097646
Attorney, Agent or Firm:
Kenji Kamada
Hiroo Maeda



 
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