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Title:
POLYMER, RESIN FILM AND ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2017133034
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in resolution, which allows formation of a resin film excellent in elongation properties.SOLUTION: The photosensitive resin composition comprises: (A) a polymer having a structural unit represented by formula (A1); and (B) a photosensitive acid generator. In formula (A1), Arrepresents a divalent group having an aromatic ring and having two bonds present in the aromatic ring structure, where Arhas at least two in total of at least one type of group selected from a phenolic hydroxyl group and a carboxyl group; and Rrepresents an alkanediyl group, a divalent group having a saturated aliphatic ring or a divalent group having an aromatic ring, or a divalent group derived from the above described groups by substituting at least one hydrogen atom possessed by the alkanediyl group, the saturated aliphatic ring or the aromatic ring with an organic group (excluding a group having a saturated aliphatic ring and a group having an aromatic ring).SELECTED DRAWING: None

Inventors:
NISHIMURA ISAO
UCHIDA TARO
MATSUMURA TORU
INOMATA KATSUMI
MARUYAMA YOICHIRO
Application Number:
JP2017082708A
Publication Date:
August 03, 2017
Filing Date:
April 19, 2017
Export Citation:
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Assignee:
JSR CORP
International Classes:
C08G65/40
Domestic Patent References:
JP2005266049A2005-09-29
JP2004263154A2004-09-24
JP2011219751A2011-11-04
JP2005099246A2005-04-14
Foreign References:
WO2012050064A12012-04-19
WO2007094436A12007-08-23
Attorney, Agent or Firm:
Patent corporation ssinpat