Title:
圧力センサ
Document Type and Number:
Japanese Patent JP7370028
Kind Code:
B2
Abstract:
The pressure sensor 10 comprises: a bottomed cylindrical sensor module 11 having inside a pressure receiving chamber C1 communicating with a flow path and including a diaphragm 11a in contact with the pressure receiving chamber; a pressure detecting element 12 for outputting a strain of the diaphragm 11a as a pressure; a base ring 14 fixed at an outer edge of an open-side end part 11c of the sensor module and disposed on an outer peripheral side of the sensor module 11; a hermetic member 13 fixed to the base ring 14 for forming a sealed vacuum chamber C2 opposite to the pressure receiving chamber C1 across the diaphragm 11a; a gasket 18 sandwiched between the base ring 14 and a body 5; and a pressing flange 19 for pressing the base ring 14 to the body 5 through the gasket 18.
Inventors:
Atsushi Hidaka
Takanori Nakatani
Kaoru Hirata
Koji Nishino
Shinichi Ikeda
Masanori Fukasawa
Takanori Nakatani
Kaoru Hirata
Koji Nishino
Shinichi Ikeda
Masanori Fukasawa
Application Number:
JP2022571928A
Publication Date:
October 27, 2023
Filing Date:
November 02, 2021
Export Citation:
Assignee:
Fujikin Co., Ltd.
Nidek Components Co., Ltd.
Nidek Components Co., Ltd.
International Classes:
G01L19/06
Domestic Patent References:
| JP2013057512A | ||||
| JP2005148002A |
Foreign References:
| WO2020075600A1 | ||||
| WO2014155994A1 | ||||
| US20170363499 |
Attorney, Agent or Firm:
Ryuichi Yata
Kenichi Yoshitake
Kenichi Yoshitake