Title:
PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2023126136
Kind Code:
A
Abstract:
To provide a printed wiring board having high quality.SOLUTION: The printed wiring board includes: a first conductor layer; a resin insulating layer which is formed on the first conductor layer and has an opening for a via conductor, the opening exposing the first conductor layer; a second conductor layer which is formed on the resin insulating layer; and a via conductor which is formed in the opening and connects the first conductor layer and the second conductor layer. The second conductor layer and the via conductor are formed of a seed layer and an electrolytic plating layer on the seed layer. The resin insulating layer is formed of inorganic particles and a resin. The inorganic particles include first inorganic particles forming an inner wall surface of the opening and second inorganic particles buried in the resin insulating layer. The shape of the first inorganic particles is different from the shape of the second inorganic particles.SELECTED DRAWING: Figure 1
Inventors:
SAKAI JUN
INISHI TAKUYA
INISHI TAKUYA
Application Number:
JP2023000806A
Publication Date:
September 07, 2023
Filing Date:
January 06, 2023
Export Citation:
Assignee:
IBIDEN CO LTD
International Classes:
H05K3/46; H05K1/02; H05K1/03; H05K1/11; H05K3/40
Attorney, Agent or Firm:
Norihisa Mori